JPH0745899Y2 - 突出部を有する外部接続端子および当該外部接続端子を備えた混成集積回路装置 - Google Patents
突出部を有する外部接続端子および当該外部接続端子を備えた混成集積回路装置Info
- Publication number
- JPH0745899Y2 JPH0745899Y2 JP1990115991U JP11599190U JPH0745899Y2 JP H0745899 Y2 JPH0745899 Y2 JP H0745899Y2 JP 1990115991 U JP1990115991 U JP 1990115991U JP 11599190 U JP11599190 U JP 11599190U JP H0745899 Y2 JPH0745899 Y2 JP H0745899Y2
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- connection terminal
- integrated circuit
- hybrid integrated
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000012212 insulator Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115991U JPH0745899Y2 (ja) | 1990-11-06 | 1990-11-06 | 突出部を有する外部接続端子および当該外部接続端子を備えた混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115991U JPH0745899Y2 (ja) | 1990-11-06 | 1990-11-06 | 突出部を有する外部接続端子および当該外部接続端子を備えた混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0472562U JPH0472562U (en]) | 1992-06-25 |
| JPH0745899Y2 true JPH0745899Y2 (ja) | 1995-10-18 |
Family
ID=31863800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990115991U Expired - Lifetime JPH0745899Y2 (ja) | 1990-11-06 | 1990-11-06 | 突出部を有する外部接続端子および当該外部接続端子を備えた混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0745899Y2 (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2571685Y2 (ja) * | 1992-07-28 | 1998-05-18 | 太陽誘電株式会社 | 混成集積回路装置用リードアレイおよび混成集積回路装置 |
| EP1821368A4 (en) * | 2005-03-01 | 2010-12-29 | Panasonic Corp | CONNECTORS BETWEEN SUBSTRATES AND PCB PLATE DEVICE WITH CONNECTORS BETWEEN SUBSTRATES |
| JP5280108B2 (ja) * | 2008-05-29 | 2013-09-04 | 京セラ株式会社 | 端子部品及び携帯電子機器 |
-
1990
- 1990-11-06 JP JP1990115991U patent/JPH0745899Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0472562U (en]) | 1992-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |